Function
The atmospheric pressure plasma(AP Plasma) removes organic pollutants under the atmospheric environment.
The atmospheric pressure plasma(AP Plasma) reaches the function of surface cleaning, surface modification and promotes the reliability of components’ package, mounting and printing.
Easy operate and can adjust power, process distance、process speed and gas, etc.
Process material：Glass, Plastic, Metallic, Ceramics, Rubber, etc.

Features
．Multiple patents design.
．High efficiency plasma, processing speeds quickly, excellent cleaning efficiency.
．variety of nozzles can be chosen, clean range : 3~30mm.
．Process gas：N2, Air(CDA), Ar, O2.
．Can Start / Stop at any time.
．Can be in-line or off-line operation.
．No contamination, no arc.
．Small size, easy install and maintenance.
．Customization.

Application Industry
．STN-LCD, TFT-LCD, OLED or PDP , OLB process of COG ITO electrode surface is clean before.
．COF (ILB) or COB electrode surface cleaning process.
．LCD or OLED glass cleaning.
．IC Packaging (Flip Chip, CSP, BGA, TCP, or Lead Frame, etc.) or LED package for surface cleaning or modification.
．PCB surface cleaning, activation, modified, or desmear.
．Wafer surface cleaning, or coater.
．The surface cleaning of industrial electronic components, activated or modified.
．Before printing or adhesive surface roughening or cleaning.
．Coating, to coater and etching.